PUBLIC INTEREST CENTER: (614) 644-2160
MEDIA CONTACT: Heather Lauer
CITIZEN CONTACT: Darla Peelle
Ohio EPA to Accept Comments Regarding Stony Hollow Landfill Proposed Expansion
Public Hearing Scheduled for Dec. 11, 2013
The public may comment on a proposed expansion of Stony Hollow Landfill at a 6:30 p.m. meeting on Dec. 11, 2013, in the Dayton Cultural and RTA Transit Center-Zion Theatre, 40 S. Edwin Moses Blvd., Dayton. The meeting will begin with an information session; the hearing will immediately follow.
The landfill is located at 2460 South Gettysburg Avenue, Dayton. The permit would authorize a vertical expansion of the existing municipal solid waste landfill. The approved disposal capacity would increase by approximately 5.9 million cubic yards to 18.8 million cubic yards. The total acreage within the limits of waste placement would remain 69.6 acres. The anticipated life expectancy would be 21.8 years based on the anticipated average daily waste receipt of 916 tons.
Written comments are weighted the same as those received at the hearing. Written comments must be received by the close of business on Dec. 18, 2013. Written comments may be presented in person at the hearing or mailed to Ohio EPA, Division of Materials and Waste Management, Information Resources Management, P.O. Box 1049, Columbus, Ohio 43216-1049.
Copies of the draft may be reviewed at Ohio EPA’s Southwest District Office, 401 E. Fifth St., Dayton, by first calling (937) 285-6357 or Ohio EPA Central Office, Division of Materials and Waste Management, 50 W. Town St., Suite 700, Columbus, by first calling (614) 644-2621.
The Ohio Environmental Protection Agency was created in 1972 to consolidate efforts to protect and improve air quality, water quality and waste management in Ohio. Since then, air pollutants dropped by as much as 90 percent; large rivers meeting standards improved from 21 percent to 89 percent; and hundreds of polluting, open dumps were replaced with engineered landfills and an increased emphasis on waste reduction and recycling.